PHOTOSENSITIVE RESIN COMPOSITION

摘要

Problem to be Solved To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving. Solution A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20°C of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20°C of 5 Pa·s or more and 500 Pa·s or less.