发明名称 Methods of forming fine patterns, and methods of forming trench isolation layers using the same
摘要 Methods of forming a fine pattern include forming an underlying layer on a substrate, forming preliminary hard mask patterns having a first pitch on the underlying layer, the preliminary hard mask patterns having a first width and being spaced apart from each other by a second width smaller than the first width. The underlying layer is etched using the preliminary hard mask patterns as etch masks to thereby form preliminary underlying patterns. The preliminary hard mask patterns are pulled back, thereby forming hard mask patterns on the preliminary underlying patterns. An overlayer is formed on the substrate exposing top surfaces of the hard mask patterns. The hard mask patterns and the preliminary underlying patterns disposed below the hard mask patterns are etched using the overlayer as an etch mask, thereby forming underlying patterns having a second pitch smaller than the first pitch, and the overlayer is removed.
申请公布号 US7534723(B2) 申请公布日期 2009.05.19
申请号 US20060519081 申请日期 2006.09.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK JAE-HYUN;OH JAE-HEE;LEE SE-HO;JEONG WON-CHEOL
分类号 H01L21/76;C03C25/68;C23F1/00;H01L21/027;H01L21/033;H01L21/302;H01L21/461 主分类号 H01L21/76
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