Semiconductor substrate jig and method of manufacturing a semiconductor device

摘要

A semiconductor substrate jig used for arranging a film on a semiconductor substrate, wherein said semiconductor substrate jig comprises a frame with a bottom, a set of plural annular members arranged concentrically within said frame and constructed so as to be individually movable in a direction perpendicular to said semiconductor substrate, wherein heights of said annular members in said direction perpendicular to said semiconductor substrate gradually increase from an outer circumference toward an inner circumference, a biasing member for biasing each of said annular members toward said bottom of said frame, and an operating member contacting said annular members by operating movement in said frame and provided for biasing in a direction separating said annular members from said bottom of said frame, against bias force of said biasing member. Each of said annular members is movable so as to gradually press and move said film arranged between said semiconductor substrate and said set of annular members toward said semiconductor substrate from center outward with said operating movement of said operating member.