发明名称 Wiring Board and Method for manufacturing the Same
摘要 A wiring board with an electronic device comprising a plurality of trenches arranged in parallel on a substrate, a common trench communicating the plurality of trenches with each other at one of their ends on the substrate, a metal layer formed at the bottom of the plurality of trenches, and an electrode layer connected with the metal layer and formed on a bottom of the common trench, wherein the electrode layer on the bottom of the common trench constitutes a source electrode or a drain electrode of a field effect transistor, whereby the wiring board and an electronic circuit having a good fine wire pattern and a good narrow gap between the patterns using a coating material can be formed, and a reduction for a cost of an organic thin film electronic device and the electronic circuit can be attained since they can be realized through a development of a printing technique.
申请公布号 US2009114958(A1) 申请公布日期 2009.05.07
申请号 US20080264936 申请日期 2008.11.05
申请人 HITACHI, LTD. 发明人 NAKAZATO NORIO;FUJIEDA NOBUO;ISHIBASHI MASAYOSHI;KATO MIDORI;ARAI TADASHI;SHIBA TAKEO
分类号 H01L29/78;H01L21/311 主分类号 H01L29/78
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