发明名称 SUSPENSION SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a suspension substrate which can suppress reduction of transmission loss and is excellent in substrate reliability in a long term use. SOLUTION: The suspension substrate has: a metal support substrate 1 which has a concave portion; a ground layer 2 which is formed in a valley and is higher than the metal support substrate in conductivity; an insulating layer 3 formed on the metal support substrate and the ground layer; and a wiring pattern 4 formed on the insulating layer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009093735(A) 申请公布日期 2009.04.30
申请号 JP20070262256 申请日期 2007.10.05
申请人 DAINIPPON PRINTING CO LTD 发明人 NARITA YUJI;TANAKA MASAYA;OTA TAKAYUKI
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
代理机构 代理人
主权项
地址