发明名称 |
SUSPENSION SUBSTRATE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a suspension substrate which can suppress reduction of transmission loss and is excellent in substrate reliability in a long term use. SOLUTION: The suspension substrate has: a metal support substrate 1 which has a concave portion; a ground layer 2 which is formed in a valley and is higher than the metal support substrate in conductivity; an insulating layer 3 formed on the metal support substrate and the ground layer; and a wiring pattern 4 formed on the insulating layer. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009093735(A) |
申请公布日期 |
2009.04.30 |
申请号 |
JP20070262256 |
申请日期 |
2007.10.05 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
NARITA YUJI;TANAKA MASAYA;OTA TAKAYUKI |
分类号 |
G11B5/60;G11B21/21 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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