High temperature solder for the production of discharge lamp by a solder connection between a tungsten-based electrode and molybdenum-based supporting bar, comprises molybdenum and ruthenium as main component, and further metals

摘要

The high temperature solder for the production of discharge lamp by a solder connection between a tungsten-based electrode and molybdenum-based supporting bar, comprises molybdenum (30-60 wt.%), ruthenium (30-60 wt.%), and further metals (2-20 wt.%). A metal is dissolved as additional component in the solder mixture in one or more phases, which consist of molybdenum and ruthenium. The solder has a melting point of below 1900[deg] C and consists of a phase. The high temperature solder is a metal granulate (3). The degrading metal has a melting point of more than 1000[deg] C. The high temperature solder for the production of discharge lamp by a solder connection between a tungsten-based electrode and molybdenum-based supporting bar, comprises molybdenum (30-60 wt.%), ruthenium (30-60 wt.%), and further metals (2-20 wt.%). A metal is dissolved as additional component in the solder mixture in one or more phases, which consist of molybdenum and ruthenium. The solder has a melting point of below 1900[deg] C and consists of a phase. The high temperature solder is a metal granulate (3). The degrading metal has a melting point of more than 1000[deg] C and is cobalt, iron, manganese, chromium and vanadium. Independent claims are included for: (1) method for the production of high temperature solder; (2) method for the production of solder connection between a tungsten-based electrode and molybdenum-based supporting bar; (3) method for the production of discharge lamp; (4) a solder connection; (5) a discharge lamp; and (6) a paste containing high temperature solder.