发明名称 |
GLASS CAP MOLDING PACKAGE, MANUFACTURING METHOD THEREOF AND CAMERA MODULE |
摘要 |
The present invention is to reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process. In order to achieve the object, the present invention provides a glass cap molding package including a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member and exposing the external connection terminal of the substrate to a lateral surface of the substrate, a manufacturing method thereof and a camera module including the same. |
申请公布号 |
US2009085138(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20080194988 |
申请日期 |
2008.08.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
RYU JIN MUN;LEE JUNG SEOK;PARK HYUNG KYU;KIM BO KYOUNG;WOO YUN SEOK;KIM JUNG JIN |
分类号 |
H01L27/146;H01L21/00;H01L23/02;H01L23/28;H01L27/14;H04N5/335 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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