发明名称 GLASS CAP MOLDING PACKAGE, MANUFACTURING METHOD THEREOF AND CAMERA MODULE
摘要 The present invention is to reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process. In order to achieve the object, the present invention provides a glass cap molding package including a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member and exposing the external connection terminal of the substrate to a lateral surface of the substrate, a manufacturing method thereof and a camera module including the same.
申请公布号 US2009085138(A1) 申请公布日期 2009.04.02
申请号 US20080194988 申请日期 2008.08.20
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 RYU JIN MUN;LEE JUNG SEOK;PARK HYUNG KYU;KIM BO KYOUNG;WOO YUN SEOK;KIM JUNG JIN
分类号 H01L27/146;H01L21/00;H01L23/02;H01L23/28;H01L27/14;H04N5/335 主分类号 H01L27/146
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