发明名称 COPPER CLAD LAMINATE COMPRISING HONEYCOMB TYPE REINFORCEMENT AND MANUFACTURING METHOD THEREOF
摘要 A substrate laminated a copper thin film having a reinforcement material of a honeycomb type and a manufacturing method thereof are provided to use the substrate efficiently and to minimize a rate of process failure at the same time. A method for manufacturing a substrate laminated a copper thin film having a reinforcement material of a honeycomb type comprises the following steps of: forming a honeycomb form(121) divided with a plurality of cells by using glass fiber of a fabric typed or a staple type; drying and filling a polymer resin(122) in the cell of the honeycomb form; cutting outcomes; and gluing the outcomes with the copper thin film(110).
申请公布号 KR20090029382(A) 申请公布日期 2009.03.23
申请号 KR20070094573 申请日期 2007.09.18
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KWON, SOON CHUL;PARK, HA NA
分类号 B32B15/14;B32B15/08;B32B15/20 主分类号 B32B15/14
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