发明名称 |
COPPER CLAD LAMINATE COMPRISING HONEYCOMB TYPE REINFORCEMENT AND MANUFACTURING METHOD THEREOF |
摘要 |
A substrate laminated a copper thin film having a reinforcement material of a honeycomb type and a manufacturing method thereof are provided to use the substrate efficiently and to minimize a rate of process failure at the same time. A method for manufacturing a substrate laminated a copper thin film having a reinforcement material of a honeycomb type comprises the following steps of: forming a honeycomb form(121) divided with a plurality of cells by using glass fiber of a fabric typed or a staple type; drying and filling a polymer resin(122) in the cell of the honeycomb form; cutting outcomes; and gluing the outcomes with the copper thin film(110).
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申请公布号 |
KR20090029382(A) |
申请公布日期 |
2009.03.23 |
申请号 |
KR20070094573 |
申请日期 |
2007.09.18 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KWON, SOON CHUL;PARK, HA NA |
分类号 |
B32B15/14;B32B15/08;B32B15/20 |
主分类号 |
B32B15/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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