| 摘要 |
Embodiments of the invention relate to a package design incorporating an ultra-low characteristic impedance transmission line (T-line) bundle. The T-line bundle can extend from inside the package to outside the package in order to provide power delivery and power interconnect for a chip. In one embodiment, the T-line bundle can be attached at the die. In another embodiment, the T-line bundle can be attached to the package substrate. The T-line bundle can be a stack of parallel planar transmission line strips in a periodic pattern where the dielectric material of the strips can be a high-k dielectric and can be flexible, semi-rigid, or precision rigid. |
