| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for connecting a wiring board with a semiconductor device, capable of widely replacing and mounting semiconductor devices with different patterns of arrangement of connecting members or semiconductor devices with different input/output patterns, by moving a semiconductor device such as an IC in a mounting space of the wiring board. SOLUTION: By moving two opposite sides of a rectangle of a first IC 10 in parallel in a slant direction to the direction of arrangement pattern formation, it is possible to widely replace a second IC 20 with a different input/output pattern within the mounting space of the wiring board 1. The first IC 10 and the second IC 20 can be replaced and mounted simply and inexpensively by moving the first IC 10 without changing input lands IN1 and IN2 and output lands OUT1 and OUT2 of the wiring board 1. Since wiring patterns 2 and 3 can be formed beforehand by screen-printing, man-hours required for replacement of the first IC 10 and the second IC 20 can be shortened. COPYRIGHT: (C)2009,JPO&INPIT
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