发明名称 SUBSTRATE PROCESSING SYSTEM
摘要 <p>A substrate processing system is provided to improve the productivity of substrate by raising the processing ratio of system. The first to forth chambers(200a,200b,200c) have a substrate support portion(210) and a connected through a transfer chamber(300) and the first substrate gateway(202). The first substrate transfer system(600) is installed at the transfer chamber. The first substrate transfer system receives four wafers from the outside, and transmits the wafers to each substrate support portion of first to forth chambers. The first substrate transfer system receives four wafers from first to forth chambers which finish the process, and transmits the wafers to the center which is the standby position of the transfer chamber.</p>
申请公布号 KR20090020167(A) 申请公布日期 2009.02.26
申请号 KR20070084677 申请日期 2007.08.22
申请人 WI, SOON IM 发明人 WI, SOON IM
分类号 H01L21/677;H01L21/02 主分类号 H01L21/677
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