| 发明名称 |
Temperature compensated integrated circuits |
| 摘要 |
A method and system of temperature compensated integrated circuits. Operating characteristics of integrated circuitry are enhanced by application of temperature compensation.
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| 申请公布号 |
US7495497(B1) |
申请公布日期 |
2009.02.24 |
| 申请号 |
US20050125555 |
申请日期 |
2005.05.09 |
| 申请人 |
TRANSMETA CORPORATION |
发明人 |
FU ROBERT |
| 分类号 |
H03K17/687;H03K3/011;H03K3/03;H03K17/14;H03K19/003 |
主分类号 |
H03K17/687 |
| 代理机构 |
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