| 摘要 |
An apparatus for assembling a heat sink is provided to improve working efficiency by assembling a bracket lug in the heat sink received in a jig unit. A heat sink assembly device includes a jig unit(10) and a pin coupling unit(20). The jig unit fixes the heat sink. The heat sink discharges the heat generated from the semiconductor device to the outside. The jig unit is composed of a mount(11) and a press(12). The heat sink is received in the mount. The press is arranged in both side of the mount. The press reciprocates. The press pressurizes both sides of the heat sink received in the mount. The mount and the press are arranged in an elevation base. The height of the mount and the press is controlled. The pin coupling unit includes a transfer unit(21) and a coupling unit(26). The transfer unit transfers the bracket lug to both sides of the jig unit. The coupling unit assembles the bracket lug in the heat sink received in the jig unit.
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