CARRIER FOR SEMICONDUCTOR CHIP

摘要

A semiconductor chip carrier is provided to remove the possibility of contact between the ball electrode and the carrier, to arrange exactly the ball electrode and the electrode of the test board, and to prevent the electrode of the chip package from being sandwiched in the chip carrier. The semiconductor chip carrier comprises the base(10) having the settling portion(14) corresponding to the shape of the semiconductor chip(5) having the opening part(12); the latch(20) positioned at the inner surface of the upward opening part; the manipulation part(30) operating the latch; the contact unit(42) made of the conductive material; the pad(40) including body portion(44) consisting of the insulator.