SEMICONDUCTOR DEVICE AND METHOD OF PROVIDING COMMON VOLTAGE BUS AND WIRE BONDABLE REDISTRIBUTION

摘要

A semiconductor device and the method for providing the common voltage bus and wire bondable redistribution are provided to obtain the reliable package and low cost by providing the single conductive structure in which the common voltage bus is connected. The semiconductor wafer(100) comprises the plural semiconductor dies. The touch pad(102) is formed in the surface of wafer. The passivation(104) layer is formed on the wafer. The stress buffer layer(106) is formed on the passivation layer. The stress buffer layer is patterned to expose the touch pad. The metal layer is fusioned on the stress buffer layer. The metal layer is the common voltage bus for the touch pad and electrical contact. The metal layer is mounted on the seed layer. The solder bump or the other interconnection structures is formed in the metal layer.