| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating resin composition having low thermal expansibility not causing the release and the crack of a conductor circuit layer by the thermal shock test such as a cold heat cycle test, high reliability for insulation and high flame retardance even under the high-temperature and humidity environment and enabling the preparation of high-density laminate of high multilayer molding, and a prepreg, laminate and semiconductor device each using the composition. SOLUTION: In an insulating resin composition used for forming the prepreg, coefficient of linear expansion of a cured material of the insulating resin composition is≥6 ppm/°C and≤60 ppm/°C at 25°C. The insulating resin composition comprises (a) a metal hydroxide having≤500 ppm concentration of a metal ionic impurity, (b) an epoxy resin comprising a novolak type epoxy resin and being not substantially be halogenated, (c) an ultraviolet light absorbent and (d) a curing agent. COPYRIGHT: (C)2009,JPO&INPIT |
