| 摘要 |
A semiconductor wafer grinding method is provided to expand the service life of the abrasive tool by cooling the contact area between the work piece and the abrasive tool. The refrigerant is supplied to the contact zone between one or more abrasive tools with the semiconductor wafer. The abrasive tool removes the material on one side or both sides of the semiconductor wafer by using the single-side grinding attachment or both-sides grinding attachment. The flow rate of refrigerant is selected according to the height of the grinding tooth-shape part of the abrasive tool. The flow rate of refrigerant decreases according to the height of grinding tooth-shape part.
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