| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component of preventing short-circuit between electrodes and enhancing adhesive strength upon jointing an electronic element to the electrodes, and to provide an electronic component manufactured by the manufacturing method. SOLUTION: The manufacturing method for the electronic component includes an applying step of applying a conductive adhesive 13 to the electrodes 12; a temporary curing step of temporarily curing the conductive adhesive 13; a load applying step of placing the electronic element 14 on the conductive adhesive 13 to apply load to the electronic element 14; and a full curing step of fully curing the conductive adhesive 13. In the temporary curing step, the conductive adhesive 13 is temporarily cured so that a temporary curing temperature A (°C) and a temporary curing time B (minutes) satisfy equation (1): lnB≥-0.05A+7.5, and that the adhesive strength becomes 10 N/mm<SP>2</SP>or higher, after the temporary curing step. COPYRIGHT: (C)2009,JPO&INPIT
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