| 摘要 |
PURPOSE:To attain simplicity and miniaturization by constituting two directional couplers and an amplifier fitting metallic film to a prescribed position of a dielectric substrate, connecting electrically this metallic film to a rear metallic film via a through-hole and fitting an amplifier to the part. CONSTITUTION:The rear side metallic film 9 and the amplifier fitting metallic film 10 and the directional couplers 12, 13 are formed to the dielectric substrate 8 by vapor-deposition plating, and the films 9, 10 are allowed to contact electrically via a metal provided to the through-hole 11. The fitting of the amplifier to the substrate 8 and the fitting of the substrate 8 to the case are performed by using solder. Since the amplifier is constituted on one substrate, the structure is simplified and the amplifier is miniaturized.
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