| 摘要 |
<p>PURPOSE:To relax stress concentration on a corner part to reduce cracks and to enable the avoidance of dislocation of wires on the occasion of resin sealing, by shaping the plane of a semiconductor chip to be polygonal, i.e., hexagonal or above, and by providing bonding wires connecting this chip with a plurality of leads, and resin sealing. CONSTITUTION:A semiconductor chip 11 whose plane is shaped to be polygonal, hexagonal or above, a plurality of leads 12 provided around this chip 11, bonding wires 13 connecting the chip 11 with the leads 12, and a resin layer sealing the chip 11, are provided. By shaping the plane of the semiconductor chip 11 to be polygonal, hexagonal or above, stress concentration on the corner part of this chip 11 is relaxed, so that the occurrence of cracks of a protective film, wirings, etc., can be reduced. Moreover, the length of the bonding wires 13 at the corner part of the chip and the central part of a side thereof becomes uniform substantially, and this enables the prevention of dislocation of the bonding wires 13 on the occasion of resin sealing and the avoidance of short- circuit and the like.</p> |
