| 摘要 |
Wafers to be processed are supplied in serial sequence from a supply cassette and, following processing, are collected in a receiver cassette. The wafers are introduced to the pressurereducing module through a gate which is disposed between a supply section and a vacuum section. A common duct discharges gas from the processing module and the gas which provides the transport medium from the vacuum section. A respective discharge duct is provided for the gate and supply section. An entrance portal includes a valve plate in a chamber. An exit portal provides a chamber housing a valve plate, in the gate. Gas is supplied to displace the valve plates to align a respective opening for passage of the wafer into and through the gate.
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