| 摘要 |
<p>PURPOSE:To manufacture the title electronic part mounting substrate having excellent heat dissipation properties and humidity resistance by a method wherein a metallic plated layer is formed without fail on the opposite parts of a radiating plate to recessions. CONSTITUTION:Within the title electronic part mounting substrate composed of the first basic member 1A, a second base member 1B, a radiating plate 2 and a mounting recession 13 held between both members 1A, 1B through the intermediary of a bonding agent 3, exposed recessions 4 are formed striding over the second basic member 1B and the radiating plate 2. Next, a continuous metallic plated layer 75 is formed on the rear surface side of the radiating plate 2, the exposed recessions 4 and the second basic member 1B. Through these procedures, the title electrode part mounting substrate having excellent heat dissipation properties and humidity resistance needless of adjusting the bonding agent 3 while in no danger of miss-coating the radiating plate 2 can be manufactured.</p> |
