| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe and substrate inspection device capable of reducing flaw remaining in an inspection point of a substrate to be inspected, capable of enhancing the stability of contact resistance in a probe and the inspection point of the substrate to be inspected, and capable of preventing the contact point or the like from being shifted, when a solder bump is set as the inspection point, to make sure electric contact with the inspection point. SOLUTION: This probe 2 mounted on the inspection tool 3 includes a probe body 21, an insulating coating part 22 for coating at least one part of an outer circumferential part of the probe body 21, and a conductive wire rod 23 inserted into the probe body 21. The probe body 21 is formed of a conductive material like a metal, and has a slender cylindrical shape. A tip end part 21a of the probe body 21 is brought into electric contact with the inspection point of the substrate to be inspected. COPYRIGHT: (C)2009,JPO&INPIT
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