EXPOSURE METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD

摘要

An exposure method enabling deformation occurring in a unit exposure field (10f) to be measured rapidly and accurately and enabling a plurality of patterns to be superimposed on a substrate (W) with high accuracy. The exposure method of the present embodiment for exposing a bright-dark pattern on the substrate (W) using a projection optical system (PL) includes a position detection process (S13) for detecting the positions of a plurality of position detection marks, relative to a substrate-in-plane-direction of the substrate (W), arranged in at least one functional element in a unit exposure field (10f) of the substrate (W), a deformation calculation process (S14) for calculating the state of deformation occurring in the unit exposure field (10f ) based on information related to the positions of the position detection marks obtained in the position detection process (S13), and a shape modification process (S15) for modifying the shape of the bright-dark pattern to be exposed on the substrate (W) based on the deformation state obtained in the deformation calculation process (S14).