| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal treatment apparatus that can activate deep bonding without producing warpage or cracking in a substrate. <P>SOLUTION: A flush lamp FL1 connected to a short-pulse circuit SP and a flush lamp FL2 connected to a long-pulse circuit LP are alternatively arranged in a line. The light emission period of the flush lamp FL2 connected to the long-pulse circuit LP is longer than that of the flush lamp FL1 connected to the short-pulse circuit SP. A flush light with high peak intensity from the flush lamp FL1 and a flush light with moderate peak intensity from the flash lamp FL2 are overlapped, and a deep area on the surface of a substrate can be heated at the activation temperature or higher without heating a shallow area thereof than necessary. Thus, deep bonding activation can be established without producing warpage or cracking in the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
