发明名称 Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor
摘要 A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.
申请公布号 US2007109439(A1) 申请公布日期 2007.05.17
申请号 US20060540753 申请日期 2006.10.02
申请人 MINAMIO MASANORI;KOMATSU TOMOKO;ITOI KIYOKAZU;FUKUDA TOSHIYUKI 发明人 MINAMIO MASANORI;KOMATSU TOMOKO;ITOI KIYOKAZU;FUKUDA TOSHIYUKI
分类号 H04N5/225;H04N5/369 主分类号 H04N5/225
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