发明名称 |
Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor |
摘要 |
A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.
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申请公布号 |
US2007109439(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20060540753 |
申请日期 |
2006.10.02 |
申请人 |
MINAMIO MASANORI;KOMATSU TOMOKO;ITOI KIYOKAZU;FUKUDA TOSHIYUKI |
发明人 |
MINAMIO MASANORI;KOMATSU TOMOKO;ITOI KIYOKAZU;FUKUDA TOSHIYUKI |
分类号 |
H04N5/225;H04N5/369 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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