| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for depositing a metal film which is inexpensive compared with the deposition of a metal film by the conventional vacuum deposition, and can solve the problem that metal powder does not stuck onto a substrate due to its oxiidadation when the metal powder is sprayed on the substrate to deposit the metal film. SOLUTION: The inside of a working chamber is made into a gaseous nitrogen atmosphere, and a mixed fluid of gaseous nitrogen and metal powder is sprayed on a working substrate in the gaseous nitrogen atmosphere, thus a metal film can be deposited on the surface of the substrate without oxidizing the metal powder, and a wiring pattern by the metal can easily and stably be formed on the working substrate. COPYRIGHT: (C)2007,JPO&INPIT
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