| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of producing a heat resistant relief structure, excellent in in-plane uniformity after development and in in-plane uniformity after heat curing, reducing scum and excellent also in adhesion, and a method for producing a semiconductor device using the composition. <P>SOLUTION: The photosensitive resin composition contains a polyamide resin represented by formula (I) and a quinonediazidosulfonic ester of a phenol compound as a photosensitizing agent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
