| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attain the improvement of the utilization factor in a target material, the improvement of cycle time, the improvement of maintainability and the improvement of film deposition accuracy in a thin film deposition system. <P>SOLUTION: In the thin film deposition system provided with: a vacuum chamber; a sputtering cathode of holding a target material; a mounting means for mounting a substrate on which the sputtered target material is deposited; and a carrying mechanism for the mounting means, a carrying passage is provided so that the substrate passes through the front of the target material, in the carrying mechanism, and the mounting means is composed of a substrate tray capable of holding a plurality of substrates in such a manner that they are connected. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
