发明名称 PATTERN FORMING METHOD AND FUNCTION FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a pattern forming method which enables the precise formation of the pattern of a functional wiring film respect to a line width, a shape, or the like, and to prepare the functional film. <P>SOLUTION: A planned pattern is divided into sub-regions prior to forming the functional film and a plurality of the sub-regions are classified into a plurality of groups not adjacent to each other. First, drawing and drying are performed with respect to the first group to form wiring films 38a, 38b and 38d and drawing is subsequently performed with respect to the second group to form liquid patterns 33c, 33e, 33f and 33g. Thereafter, the integrated functional film is completed through a drying process. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006116417(A) 申请公布日期 2006.05.11
申请号 JP20040306602 申请日期 2004.10.21
申请人 SEIKO EPSON CORP 发明人 SAKAI MARI;HIRAI TOSHIMITSU
分类号 B05D1/26;B41J2/01;G02B5/20;H01L21/28;H01L21/288;H01L21/3205;H01L29/786 主分类号 B05D1/26
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