发明名称 |
Plating apparatus and plating method |
摘要 |
A plating apparatus can securely carry out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
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申请公布号 |
US2006086616(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20050245490 |
申请日期 |
2005.10.07 |
申请人 |
KURASHINA KEIICHI;NAGAI MIZUKI;YAMAMOTO SATORU;KANDA HIROYUKI;MISHIMA KOJI;MORISAWA SHINYA;KUNISAWA JUNJI;IDE KUNIHITO;SUZUKI HIDENAO;COOPER EMANUEL;VEREECKEN PHILIPPE;BAKER-O' NEAL BRETT;DELIGIANNI HARIKLIA |
发明人 |
KURASHINA KEIICHI;NAGAI MIZUKI;YAMAMOTO SATORU;KANDA HIROYUKI;MISHIMA KOJI;MORISAWA SHINYA;KUNISAWA JUNJI;IDE KUNIHITO;SUZUKI HIDENAO;COOPER EMANUEL;VEREECKEN PHILIPPE;BAKER-O' NEAL BRETT;DELIGIANNI HARIKLIA |
分类号 |
C25D21/12;C25B15/00 |
主分类号 |
C25D21/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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