| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor wafer capable of decreasing the occupied area of scrive lines in a semiconductor wafer. SOLUTION: A circuit element region 30 is enclosed along a dicing line D, and a groove 40 to the interior of the wafer 100 is formed between the circuit element region 30 of the wafer 100 and the dicing line D enclosing the circuit element region 30. A crack 39 in progress to the interior of the circuit element region 30 can be suppressed because the groove 40 works as a barrier to the crack 39 even if the crack 39 occurs from the dicing line of the wafer 100 to the circuit element region 30 when the wafer 100 is diced. COPYRIGHT: (C)2006,JPO&NCIPI |
