| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate which can stabilize reliability in quality at a solder joint. SOLUTION: In the substrate for mounting a component with a lead wire, a clearance, i.e., a difference between the diameter of the lead wire of a component and the diameter of a through hole provided in the substrate, is set in the range of 0.5-0.8 mm. COPYRIGHT: (C)2008,JPO&INPIT
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