METHOD FOR MANUFACTURING ELECTRONIC COMPONENT BAKING JIG

摘要

Provided is a method for manufacturing an electronic component baking jig wherein a base material and a protection layer are not easily separated. The method is provided for manufacturing the electronic component baking jig wherein the protection layer is formed on the base material. The method is provided with a step of performing main baking after forming the protection layer on the pre-baked base material. Preferably, the temperature of the pre-baking is 600°C or higher but not higher than 1,400°C, and the temperature of the main baking is 1,400°C or higher but not higher than 2,000°C.