| 摘要 |
A contact pad in an integrated circuit is disclosed. The contact pad comp rises a flat portion comprising a base (302) of the contact pad; a plurality of projections (304, 306, 308, 310, 312) extending from and substantially p erpendicular to the flat portion; and a solder ball (108, 124) attached to t he projections and the flat portion. A method of forming a contact pad is al so disclosed. |
