| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg production method capable of preventing the thinning of the surface resin layer of a prepreg on the side to be roughened when roughening the organic insulation layer of hardened prepreg using an oxidant in a production process of a multilayer wiring board by a buildup method. SOLUTION: The prepreg production method includes an impregnation process of impregnating a traveling long substrate 1 with a resin varnish 2, a regulation process of regulating the thickness of the impregnated resin varnish, and a drying process of heating and drying the resin varnish. The method is characterized in that when the substrate passes through a thickness regulation means in its process, the substrate is traveled in such a state that the traveling direction of the substrate just after passing through the thickness regulation means is different from that immediately before passing. COPYRIGHT: (C)2009,JPO&INPIT |
