发明名称 SEMICONDUCTOR MODULE AND INVERTER
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor module having a configuration capable of appropriately cooling switching elements in all substrates for the configuration where a plurality of the substrates are placed on one surface of a base plate and a refrigerant channel is provided in contact with the other surface. <P>SOLUTION: A parallel flow formation means 8 for forming a parallel flow of a refrigerant is provided in a refrigerant channel 7; the switching element 4 and a diode element 5 are arranged side by side in a direction C orthogonal to a flow direction D of the refrigerant in each substrate 3; a plurality of sets are arranged side by side in the orthogonal direction C with a pair of the substrates 3 having either the switching element 4A for a lower arm or the switching element 4B for an upper arm in a pair as one set; the pair of the substrates 3 for composing each set is arranged in series in the flow direction D of the refrigerant; and the switching element 4 is arranged at one side in the orthogonal direction C in one substrate 3 and the diode element 5 is arranged at one side in the orthogonal direction C in the other substrate 3. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008294069(A) 申请公布日期 2008.12.04
申请号 JP20070135683 申请日期 2007.05.22
申请人 AISIN AW CO LTD 发明人 AOKI KAZUO;TSURUOKA JUNJI;YASUI SEIJI
分类号 H01L25/07;H01L23/473;H01L25/18;H02M7/48 主分类号 H01L25/07
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