| 摘要 |
PROBLEM TO BE SOLVED: To reduce the residue of an adhesive of a dicing tape on the soldering surface of a semiconductor chip in a method for mounting the semiconductor chip which is obtained by performing dicing of a semiconductor wafer on a ceramic substrate and soldering them. SOLUTION: Before the dicing tape 200 is stuck, the warpage state of the semiconductor wafer 100 is measured; and one surface of the semiconductor wafer 100 is processed to have smaller surface roughness at a position 101 closer to the side of the dicing tape 200 because of the warpage than at a farther position 102, and then the dicing tape 200 is stuck on the one surface of the semiconductor wafer 100. COPYRIGHT: (C)2009,JPO&INPIT
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