| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting method for cutting a workpiece efficiently with a desired machining accuracy by suppressing a trouble during cutting in a method for cutting the workpiece such as a substrate. <P>SOLUTION: This water jet machining device retains a package mother material 8 in a retaining table 11, and adjusts start points of primary cut lines 3a by moving an X, Y, Z moving mechanism 60. Then, it jets a water jet to the package mother material 8 by moving a machining water supplying means 14, and moves the package mother material 8 along the primary cut lines 3a by the X, Y, Z moving mechanism 60, thereby cutting the package mother material 8. On this occasion, it cuts all chip laminating sections 4 into the same shape, and retains a primary cut area 8b integrally with the package mother material 8. After cutting all the primary cut lines 3a, it attaches a dicing tape 9, and then, cuts secondary cut lines 3b by a secondary cutting process in the same way as the primary cutting process. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
