发明名称 |
Method for manufacturing light emitting diode devices |
摘要 |
A method for manufacturing LED devices is disclosed to manufacture vertical LED devices without removing nonconductive substrates. A conductive substrate is formed on the LED epitaxial layer of the nonconductive substrate to form a LED wafer by bonding or electroplating, which is further cut into a plurality of LED sticks with each space layer bonded between every two LED sticks. Secondly, the plurality of LED sticks and space layers are fixed by a fixture while type I semiconductor layer and active layer of the LED epitaxial layer of each LED stick are covered by each space layer. A transparent conductive layer is further formed thereon whereby to electrically connect with the type II semiconductor layer contrary to type I and are further formed with a plurality of electrodes thereon. Finally the said LED sticks are cut to a plurality of LED devices.
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申请公布号 |
US2008293172(A1) |
申请公布日期 |
2008.11.27 |
申请号 |
US20080007051 |
申请日期 |
2008.01.04 |
申请人 |
LEE MING-SHUN;CHIU SHU-WEI |
发明人 |
LEE MING-SHUN;CHIU SHU-WEI |
分类号 |
H01L33/10;H01L33/32;H01L33/42;H01L33/44;H01L33/46 |
主分类号 |
H01L33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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