| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive cover lay film having excellent mechanical properties. <P>SOLUTION: The present invention relates to a resin composition containing a resin (A) and a plasticizer (B), characterized in that, when only the plasticizer (B) is heated, the heat-generation at starting temperture is T1(°C) and, when a composition (composition (a)) which is a mixture of the resin (A) and the plasticizer (B) is heated, the heat generation starting temparature is T2(°C) and a glass transition temperature of the resin composition is T3(°C), no heat generation is observed when the above composition (composition (a)) is heated, or the composition satisfies formula (1): T1+15°C<T2 (provided that T2(°C) is at most 250°C) and T3 satisfies formula (2): T3≤100°C. <P>COPYRIGHT: (C)2009,JPO&INPIT |
