| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture an IC tag with suppressed deterioration of performance at low material cost and processing cost. <P>SOLUTION: A Cu-coil inlet 1 is formed first. A primary molding 4 for storing the inlet 1 is formed by injection molding of polyphenylene sulfide PPC resin. A groove 5 for storing an antenna 2 and an IC chip 3 of the inlet 1 is formed in the primary molding 4. A protruding part 6 protruding to a hollow part 7 of the coil-like antenna 1 is formed on the primary molding 4. The coil-like antenna 2 and IC chip 3 of the inlet 1 are built in the primary molding 4. An inlet fixing seal 8 is then formed, and the inlet 1 is fixed to the primary molding 4 by use of the inlet fixing seal 8. PPS resin is injected onto the primary molding with the inlet 1 fixed thereto to perform secondary molding. <P>COPYRIGHT: (C)2009,JPO&INPIT |
