| 摘要 |
A semiconductor chip and a manufacturing method thereof are provided to accurately set up the semiconductor chip and to improve reliability. A semiconductor chip(1) is formed with a bump(21) to correspond to a pad electrode(11). The pad electrode is formed to be coated with a nickel layer(14). The bump has an indium layer(22) and a metallic compound interlayer(23) formed between the indium layer and nickel layer. The metallic compound interlayer is formed by alloying a copper layer(20) having a copper atom of over 0.5 atom% to 5 atom% or less, based on the indium layer and the indium atom of the corresponding indium layer. |
