| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing apparatus and a dicing method for securing satisfactory cutting property even in the case of using a thin semiconductor wafer as an object. SOLUTION: In a dicing device for cutting a semiconductor wafer 6 by a revolving blade 13, and for dividing the semiconductor wafer into semiconductor chips 6a as individual pieces, an ice blast nozzle 15 for injecting a wash medium 20 including freezing particles 20a of wash water and drops 20b in a super-cooling state to the blade 13 by using a rubber nozzle is arranged, and configured to inject the wash medium to the cutting sites of the semiconductor wafer 6 by the blade 13 or the side faces of the blade 13. Thus, it is possible to secure satisfactory cutting property even in the case of using a thin semiconductor wafer as an object by improving cooling effects, and preventing blocking due to the adhesion of fine organic foreign matters to the blade 13. COPYRIGHT: (C)2009,JPO&INPIT
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