| 摘要 |
<p>The subject is to provide a polymer material which enables to improve planarity and planarization efficiency of a polished surface and is useful as a polishing pad which generates only a few scratches. The said subject is solved by a polymer material having a tensile modulus at 50°C after saturation swelling with 50°C water of 130 to 800 MPa, a loss tangent at 50°C of not more than 0.2, and a contact angle with water of not more than 80°.</p> |
