| 摘要 |
The connection resistance between a metal bump ( 8 ) and a metal layer ( 10 ) for forming a wiring film deposited later is further decreased, the connection stability is enhanced, the wiring path passing through the metal bump ( 8 ) is further shortened, the planarity is enhanced, and the metal bump ( 8 ) does not come out easily. A wiring film interconnecting member wherein a plurality of pillar-like metal bumps ( 8 ) composed of copper and having a cross-sectional area of the top surface smaller than that of the bottom surface and interconnecting the wiring films of a multilayer wiring board are buried in an interlayer insulation film ( 10 ) in such a way that at least one end projects. The upper surface of the interlayer insulation film ( 10 ) is so curved as to be high at a part in contact with the metal bump ( 8 ) and lower gradually as being farther therefrom.
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