METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor device is provided to improve yield by sufficiently suppressing voids of an adhesive layer. A method for manufacturing a semiconductor device includes the steps of: preparing an adhesive adhesion semiconductor device(10) including a semiconductor device(1) and a film type adhesive(2) adhered to a part of at least surface of the semiconductor device; disposing the adhesive adhesion semiconductor device on a support member to contact the film type adhesive with the support member; and heating and compressing the film type adhesive so that a thickness of the film type adhesive becomes 1/10 ~ 1/2, thereby adhering the semiconductor device on the support member through the adhesive layer.