| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic wiring board which can be baked by microwave heating while avoiding an increase in the relative permittivity of an insulating layer, and also a method of manufacturing the ceramic wiring board. <P>SOLUTION: Internal wiring conductors 2, via hole conductors 3, and surface wiring conductors 4, 5 are made of a metal such as Ag-, Cu-, Pd-, Pt-base metal, and also contain an additive of a material having relative permittivity higher than the insulating layer. The additive has a relative permittivity of preferably 7 or higher. More specifically, as the additive or additives, one, two or more selected from the group of SiC, TiO<SB>2</SB>, ZrO<SB>2</SB>, MgO, AlN, Cr<SB>2</SB>O<SB>3</SB>, ZnO and Si<SB>3</SB>N<SB>4</SB>having high relative permittivities can be used. Among these additives, SiC, TiO<SB>2</SB>, ZrO<SB>2</SB>, MgO, Cr<SB>2</SB>O<SB>3</SB>, and ZnO are preferable because of their high relative permittivities with less additive amount. <P>COPYRIGHT: (C)2009,JPO&INPIT |
