| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming method for forming a minute wiring pattern. SOLUTION: The pattern forming method is provided with a first barrier forming process for making first liquid discharged from a droplet discharge head 20 reach one face of a substrate 2 and forming a first barrier demarcating a desired pattern, a pattern forming process for making second liquid discharged from the droplet discharge head 20 reach and making reached second liquid form the desired pattern by the first barrier, a solidifying process for solidifying second liquid and a first barrier removing process for removing the first barrier. COPYRIGHT: (C)2009,JPO&INPIT
|
