发明名称 PATTERN FORMING METHOD, RESIST COMPOSITION TO BE USED IN THE PATTERN FORMING METHOD, NEGATIVE DEVELOPING SOLUTION TO BE USED IN THE PATTERN FORMING METHOD AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT TO BE USED IN THE PATTERN FORMING METHOD
摘要 <p>A patterning method is provided to reduce line edge roughness, and to improve dimensional stability of a pattern. A patterning method includes the steps of: (a) coating a substrate with a resist composition containing a resin which contains repeating units represented by the following formula(NGH-1), increases in polarity under an action of an acid, and decreases in solubility in a negative type developer; (b) performing exposure; and (c) performing developing using a negative type developer. In the formula, R_NGH1 represents a hydrogen atom or alkyl group, and each of R_NGH2 to R_NGH4 represents a hydrogen atom or hydroxyl group, with the proviso that at least one of R_NGH2 to R_NGH4 represents a hydroxyl group.</p>
申请公布号 KR20080092883(A) 申请公布日期 2008.10.16
申请号 KR20080033950 申请日期 2008.04.11
申请人 FUJIFILM CORPORATION 发明人 TSUBAKI HIDEAKI;TARUTANI SHINJI;MIZUTANI KAZUYOSHI;WADA KENJI;HOSHINO WATARU
分类号 G03F7/004 主分类号 G03F7/004
代理机构 代理人
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